CAS 28768-32-3 | 4,4'-Methylenebis(N,N-diglycidylaniline)

Introduction

There are multiple epoxy groups and aromatic rings in the molecular structure of 4,4'-Methylenebis(N,N-diglycidylaniline) - AG80 Epoxy Resin, which can form a higher crosslinking density and aromatic density during the curing process, making the cured product exhibit good heat resistance, high mechanical strength, and low curing shrinkage features.

Application fields:

1. Carbon fiber and glass fiber composite materials;

2. 200~260℃ temperature-resistant structural adhesive;

3. Laminate;

4. Electrical insulation materials.

Specification of CAS 28768-32-3 | 4,4'-Methylenebis(N,N-diglycidylaniline) - AG80 Epoxy Resin

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Slow molecular mobility in 4, 4′-methylenebis (N, N-diglycidylaniline) as studied by Thermally Stimulated Depolarization Currents (TSDC) 

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